MECHANIC XGSP50 Special Solder Paste 183℃ SMD BGA PCB Stencil Mobile Repair

Professional grade MECHANIC XGSP50 solder paste designed for precision electronics repair, microsoldering and PCB rework applications.

Main specifications

• Brand: Mechanic
• Model: XGSP50
• Alloy composition: Sn63/Pb37
• Melting point: 183°C
• Particle size: typically 20–45 μm
• Weight: 42g
• Type: Leaded solder paste for reflow and repair
• Common uses:
  • SMD soldering
  • BGA reballing
  • PCB repair
  • Mobile phone motherboard repair
  • IC/CPU/GPU micro-soldering

Key features

• standard (183°C) paste with slightly stronger conventional joints for general SMT/BGA use
• Good wetting and adhesion on pads/components
• Suitable for hot air or reflow work
• Low residue / often marketed as “no-clean”
• Thick consistency helps component placement
• Designed for precision electronics repair work

Storage and usage notes

• Best stored refrigerated (around 0–10°C) to extend shelf life.
• Stir or mix slightly before use if separation occurs.
• Some users report older paste becoming dry or “crumbly” over time.

Typical applications

• Smartphone motherboard repair
• SMT assembly
• Reballing ICs
• Fine-pitch PCB soldering
• Prototype electronics work

Documentation available

• MSDS / SDS
• RoHS compliance documentation

Documentation can be provided upon request if required for professional or commercial use.

Package Includes

• 1x MECHANIC XGSP50 Solder Paste